Pulsed laser cleaning machine

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Laser cleaning machine

The principle of the pulse laser cleaning device is to use high-frequency laser pulses to irradiate the surface of the part. The coating layer instantly absorbs the concentrated laser energy, forming plasma (a highly ionized unstable gas), which generates shock waves that impact the contaminants, breaking them into small pieces, resulting in immediate evaporation or peeling. In such a way, oils, rust, surface adhesives, or coatings absorb energy on the surface and expand rapidly

Nanosecond laser pulses acting on the surface of contaminants can reduce excessive substrate temperature due to heat accumulation and conduction, so that contaminants quickly reach the threshold of separation and removal. Consequently, they improve the cleaning capability and efficiency. If the substrate is very sensitive, this type of laser is more suitable for protecting it from damage and reducing the complexity of controlling the cleaning process parameters

Technical Specifications of 500W Laser Cleaner

Voltage Single-phase 220V±10%, 50/60Hz AC
Power Consumption 4000W
Average Laser Power 500W
Power Adjustability 10-100 (gradient adjustable)
Pulse Frequency 20-50 (gradient adjustable)
Laser Wavelength 1064
Single Pulse Energy 1.5mj
Laser Output Type Pulsed
Cooling System Water-cooled Chiller
Device Dimensions 1130mm×830mm×1300mm
Device Weight
170Kg

Technical Specifications of 300W Laser Cleaner

Average Laser Power 300W
Power Adjustability 10-100 (gradient adjustable)
Pulse Frequency 20-50 (gradient adjustable)
Laser Wavelength 1064
Single Pulse Energy 1.5/15/50mj
Laser Output Type Pulsed
Cooling System Water-cooled Chiller
Device Dimensions 832mm×572mm×1032mm
Device Weight
170Kg
Fiber Length
5m

Laser Cleaner Head

In the cleaning process with the laser cleaning device, a slower galvanometer scan speed is used, allowing the laser pulse energy to accumulate more and effectively remove the contaminated layer. However, this may cause secondary oxidation. Reducing the scan speed may result in the inability of the device to remove stubborn contaminants effectively